DXC-0083 Micro BGA Test Probe
Max Outer Diameter：0.62mm
Total Length：5.7mm
Rating：12V/1.0A
Spring Force：60g±12g
Max Impedance：50mΩ
Cycle Life：5,000 cycles
Material: Beryllium copper, 10U gold plating
- Ultra-thin 0.62mm body, suitable for high-density layout of fine-pitch tiny BGA chips
- Elastic beryllium copper maintains stable spring force for medium-low frequency chip testing
- 10U gold plating resists wear & oxidation to deliver consistent test signals
- Balanced 60g force achieves full contact without damaging miniature solder pads
- Compact short size saves fixture space for mini inspection tooling
Tiny BGA chips, miniature ICs, slim mainboard spot testing, micro semiconductor component function verification. Custom tip shape, force and dimensions available.
