DXC-0076 BGA Spring Test Probe
Max Outer Diameter：2mm
Total Length：13.75mm
Rating：12V/2.0A
Spring Force：35g±20%
Max Impedance：35mΩ
Cycle Life：100,000 cycles
Material: Beryllium copper, 20U thick gold plating
- High-elastic beryllium copper, stable performance after 100,000 frequent test cycles
- 20U heavy gold plating resists oxidation & abrasion for precise steady signal transmission
- Gentle 35g spring force prevents scratch and damage to delicate BGA solder pads
- Low 35mΩ impedance minimizes power loss, ensures accurate test reading under 2A load
- Precision machined for tight tolerance, ideal for high-density pin layout of BGA test fixtures
BGA chip test jigs, PCB circuit board inspection fixtures, semiconductor burn-in testing, precision IC function verification. Custom tip shape, spring force and dimensions available.
