ICT Test Probe 0.75mm
Pogo Pin

Soldering Cup Pogopin

DX-5517 Wire Solder Pogopin Spring Probe with Solder Cup, Reliable Contact for Power & Signal Connection

Electric current
1.0A
Resistance
50mΩ
Plating
Gold plated 5U
Material
Brass (HBi59)

DX-5517 Wire Solder Type Pogopin Spring Pin

Max Outer Diameter: 2mm
Overall Length: 11.3mm
Rating: 12V/1.0A
Spring Force: 50g ±15g
Contact Resistance: 50mΩ
Service Life: 10,000 cycles
Body Material: HBi59 brass
Surface Plating: 5U gold


DX5517 Dimensions

cup template

5517-3D
  • Solder cup tail for easy wire soldering, flexible assembly
  • Gold plating prevents oxidation for stable power & signal transmission
  • Tough brass body resists bending and deformation
  • Customizable current capacity:1A/5A/10A available
Ideal for compact digital electronics, built-in charging modules, internal wiring connections of small devices and mini smart accessories.Different from board-mount pins, this wire-solder structure works perfectly for products with special space layouts requiring lead-out wiring. Custom modification for your exclusive device solution is available.